Ceria (cerium oxide, CeO2) nano abrasive powder finds applications in the precision polishing of most semiconductor substrate materials including silicon, sapphire, GaAs, etc. Ceria nano abrasive powder has been shown to not only demonstrate tremendous advantages in the planarization process of most semiconductor materials but glassy materials employed in photonic applications as well.

Ceria powder is fabricated in scaled quantities with a mean particle diameter of 8 nm, and ships in three prepackaged form factors: powder, aqueous pH modified dispersion, and organic liquid dispersion. Custom form factors are available upon request.

The Meliorum Technologies Cerium Oxide product ships in prepackaged 5 gram, 25 gram, 100 gram, 500 gram and 1 kilogram quantities. For dispersion form factors, concentrations are 10% by weight.

• 44 sq. meters/gram

For additional information, please follow these links:

• CeO2 Product #09817 Specifications
• Ordering information/quote request